发明名称 MODULE
摘要 PROBLEM TO BE SOLVED: To provide a module capable of reducing a mounting area without depending on a size of a component element to be mounted. SOLUTION: The module includes: a component element mounting member comprising a substrate part and a pillar part; a plurality of component elements mounted on the substrate part; and a plurality of external connection terminals provided on a pillar part surface facing a surface where the pillar part and the substrate part are in contact with each other. In the module, the pillar part surface where the external connection terminals are provided is smaller in area than the surface of the substrate part facing the pillar part surface. That is to say, when such module is used as a module in an electronic apparatus, the pillar part surface facing the surface where the pillar part, on which the external connection terminals are provided, and the substrate part are in contact with each other provides an area required in mounting the module in the electronic apparatus, by using the component element mounting member having a cross-sectional shape of a T-shape. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181546(A) 申请公布日期 2011.09.15
申请号 JP20100041592 申请日期 2010.02.26
申请人 KYOCERA KINSEKI CORP 发明人 AKAGAWA HIROAKI;ITO HISATOSHI;OKUDA YOSHIHISA
分类号 H01L25/16;H01L23/12;H01L25/00;H01L25/04;H01L25/18 主分类号 H01L25/16
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