| 摘要 |
An I/O connector has a housing that contains a plurality of individual terminal wafers containing terminal dedicated to either ground signals or differential signals. The terminals are arranged in widthwise order to define broadside coupled differential signal terminal pairs. The ground terminals are wider than the signal terminals to provide shielding to the differential signal pairs. The body portions of the ground terminals include pairs of opposed notches that provide for increased retention of the ground terminals in the wafer and provide increased flow for molding material during the formation of the wafers. |
