发明名称 |
High Strength, High Density Carrier Plate |
摘要 |
A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.
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申请公布号 |
US2011220595(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US201113114518 |
申请日期 |
2011.05.24 |
申请人 |
ELECTRO SCIENTIFIC INDUSTRIES, INC. |
发明人 |
SECOY TODD C.;DOUGHERTY DALE S.;COLE MIKEL S.;GARCIA DOUGLAS J.;WERNERT MICHELLE |
分类号 |
F16M13/00 |
主分类号 |
F16M13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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