| 摘要 |
<p>The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said information, partitioning the region containing the selected large foreign body (A) into multiple polishing areas (a), pressing against each polishing area (a) a polishing head for polishing until said polishing areas reach a prescribed height (h), and automatically moving to the next polishing area (a) for successive polishing and height measurements. Thus, even given large foreign bodies, polishing and correction are performed reliably and product quality is improved.</p> |
