| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead pin for a semiconductor mounting substrate that is vertically installed precisely. SOLUTION: The T-shaped lead pin 1 for the semiconductor mounting substrate which comprises a shaft and a collar is characterized in that the collar has a plurality of spherical projections smaller than a diameter of the collar at a flat part on a side of a part to be connected, and the spherical projections have a uniform height for pads to be connected. A semiconductor package substrate is mounted with the lead pin 1 for the semiconductor mounting substrate, and the spherical projections come into contact with the pads to be connected of the semiconductor mounting substrate. COPYRIGHT: (C)2011,JPO&INPIT
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