发明名称 METHOD OF FORMING CONDUCTOR PATTERN, WIRING SUBSTRATE, DROPLET DISCHARGE APPARATUS, AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern, capable of preventing generation of disconnection or short circuit, or the like, and forming a conductor pattern with high reliability, and the like. SOLUTION: A method of forming a conductor pattern includes a nozzle inspection step, a drawing data producing step, a conductor pattern precursor forming step, and a baking step. The drawing data producing step includes a bitmap data producing step; a tentative drawing data producing step; and a drawing data correcting step of correcting the tentative drawing data to acquire drawing data. The pitch of a pixel 81 of a bitmap 8 is equal to or less than 1/2 (does not include 0) of a diameter of the droplet of ink for forming the conductor pattern after the droplet is spotted on a base material. In the drawing data correcting step, information, indicating that the usage of a defective nozzle specified in the nozzle inspection step is prohibited is added as the drawing data, and in the conductor pattern precursor forming step, main scanning is carried out, without using the defective nozzle based on the drawing data. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181701(A) 申请公布日期 2011.09.15
申请号 JP20100044741 申请日期 2010.03.01
申请人 SEIKO EPSON CORP 发明人 KOBAYASHI TOSHIYUKI;TOYODA NAOYUKI;HAMA YOSHIKAZU;TANABE KENTARO;ISOBE MITSUHIRO
分类号 H05K3/10;B05D1/26;B05D5/12;H01B13/00;H05K3/00 主分类号 H05K3/10
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