| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal thin plate used for interposing and assembling a diode chip by a lead frame, which allows stable solder connection and reduces cost. SOLUTION: This metal thin plate 10 includes: a long tie bar part 10T formed by drilling one or more pilot holes; a plurality of cut parts 10S each located at a position distant from the pilot hole 10P of the tie bar part 10T by a predetermined distance and extended from the tie bar 10T perpendicularly to and in the same direction as that of the tie bar 10T; and L-shaped lead frame parts 10L each formed of a long part extended from the another end of each cut part 10S and a hook part extended in the right angle direction from the long part. When one out of the two metal plates 10 is turned over, the tie bars 10T, 20T are superposed on each other and the pilot holes 10P, 20P are adjusted to be registered to each other, chip connection parts 10C, 20C of the hook parts of the L-shaped lead frame parts face each other and a diode chip D is interposed therebetween. COPYRIGHT: (C)2011,JPO&INPIT
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