| 摘要 |
PROBLEM TO BE SOLVED: To improve the speed of signal transmission between laminated packages. SOLUTION: The multi-chip package laminated with multiple chips is provided, wherein each of the multiple chips includes a lot of inductor pads configured to transmit power or signals to one another, and first and second inductor pads having magnetic flux directions different from each other are formed on both sides of a reference inductor pad being any one of the multiple inductor pads. COPYRIGHT: (C)2011,JPO&INPIT
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