发明名称 |
BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES |
摘要 |
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of inorganic filler in the spaces. The thickness of the layer of inorganic filler is the same as the thickness of the electrode structures.
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申请公布号 |
US2011220909(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US200913129842 |
申请日期 |
2009.12.04 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
STAINER MATTHEW;TSAI YAW-MING A. |
分类号 |
H01L29/786;H01L21/44;H01L21/445 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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