STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY

摘要

PROBLEM TO BE SOLVED: To provide a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate.

SOLUTION: In the bonding structure in which the metal plate 1 and an electrode 3 of the piezoelectric body 2 are bonded by an electrically conductive adhesive 10 so as to have electrical conductivity, the electrically conductive adhesive 10 includes carbon black particles 12a having an average diameter of a nano-level so that the carbon black particles form an aggregate 12 with an average diameter of 1 to 50 μm. The carbon black aggregate 12 is deformed and interposed so as to follow the unevenness of the surface of the metal plate 1 and the electrode 3. The island carbon black aggregate 12 is present in plural places between the metal plate 1 and the electrode 3.

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