| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonder device capable of improving productivity while capable of reducing a connection failure between an element mounting member and an integrated circuit element by the reducing diffusion of a connection pad with a bump. SOLUTION: The bump bonder device includes: an integrated circuit element wafer arrangement means for arranging an integrated circuit element wafer where the arrangement means has a plurality of arrangements ; a heating and cooling means for heating and cooling each of the plurality of arrangements; a mounting means having capillary for mounting a bump to a connection pad of each integrated circuit element of the integrated circuit element wafer; a recognition means measuring image data of a connection bump and temperature data showing a temperature at each arrangement; a storage means storing the image data and the temperature data; and a control means controlling the heating and cooling means and the mounting means based on mounting data and the temperature data where the mounting data obtained from the image data represent an X-coordinate and a Y-coordinate showing a position of the connection pad of each integrated circuit element. COPYRIGHT: (C)2011,JPO&INPIT |
