| 摘要 |
PROBLEM TO BE SOLVED: To achieve a method for visually inspecting the thickness of a silicon film of an SOI wafer. SOLUTION: The thickness of the silicon film is inspected by visually observing interference fringes of reflection light 7, 8 reflected by the SOI wafer 1 when visible light 2 including a wavelength near the wavelength of infra-red light and emitted from a light source, is radiated on the surface 4 of the SOI wafer 1 at an angle. COPYRIGHT: (C)2011,JPO&INPIT
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