发明名称 |
PACKAGE HAVING SPACED APART HEAT SINK |
摘要 |
An integrated circuit (IC) package that includes a lead frame, and a die affixed to a first surface of a pad of the lead frame. The die is wire bonded to the lead frame. The package includes a heat sink spaced apart from a second surface of the pad, where the second surface opposes the first surface. Molding compound encapsulates the lead frame and the die. The molding compound is disposed between the heat sink and the second surface of the pad and is enabled access between the heat sink and the second surface through protruding features disposed on the heat sink, the second surface, and/or some combination of the two. |
申请公布号 |
WO2011112728(A2) |
申请公布日期 |
2011.09.15 |
申请号 |
WO2011US27768 |
申请日期 |
2011.03.09 |
申请人 |
ALTERA CORPORATION;LIM, KEN, BENG;TOONG, TEIK, TIONG |
发明人 |
LIM, KEN, BENG;TOONG, TEIK, TIONG |
分类号 |
H01L23/34;H01L23/28;H01L23/495 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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