| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve joining between a package structure and a substrate, and to extend a solder joint life even when thermal stress is applied. <P>SOLUTION: A package structure is configured such that a semiconductor chip, an island 112 of a lead frame 110, and a plurality of external connection terminals 106 are sealed with a sealing resin from one surface side, and an island 112 and the plurality of external connection terminals 106 are exposed on the other surface side. Each external connection terminal 106 of the lead frame 110 used in the package structure includes: a first external connection terminal 106a disposed at a central part of each of sides of an outer rim of a semiconductor chip mounting region 154 where the semiconductor chip is mounted; and a second external connection terminal 106b arranged outside the first external connection terminal 106a at each of the sides of the outer rim of the semiconductor chip mounting region 154, wherein the first external connection terminal 106a is larger in area than the second external connection terminal 106b. <P>COPYRIGHT: (C)2011,JPO&INPIT |
