| 摘要 |
PROBLEM TO BE SOLVED: To mount a plurality of chips having fluctuations in outer shape, in positions where those chips do not come into contact with each other, and to attain high density without any trouble, when mounting the chips. SOLUTION: A camera 5 is moved to above a chip 1a to be mounted first to image the chip from above. The chip is recognized by pattern matching technique to acquire the position and outer shape size of the chip. The chip is mounted in a predetermined mounting position and when a chip 1b to be mounted second is moved to the predetermined mounting position, it is computed in an operation region 20b whether the chips come into contact with each other including mounting precision and outer shape sizes. When they do not come into contact with each other, the second chip 1b is mounted in the predetermined mounting position, but when they come into contact, an amount of contact between the chips is offset-corrected to move and mount the second chip 1b. COPYRIGHT: (C)2011,JPO&INPIT
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