CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a circuit board suppressing remaining of bubbles between a semiconductor memory chip and itself to improve adhesive reliability.

SOLUTION: A circuit board 2 has: a base material 21 on which a circuit pattern 23 is formed; and a solder resist film 22 that covers a first surface 21a of the base material 21. The solder resist film 22 is formed, as a whole, into a convex shape in which the film thickness×1 of the center part of the base material 21 is larger than the film thickness×2 of a surrounding part of the base material 21. The remaining bubbles are suppressed thereby to improve the adhesive reliability.

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