| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce costs associated with use of adhesives when assembling modularized components, particularly for assemblies having many elements, such as battery modules. <P>SOLUTION: A method includes the following steps: (a) dispensing a UV curable high-wettability adhesive into a first module fixture populated with a plurality of elements, wherein the first module fixture provides a plurality of bonding wells with each bonding well accepting a first portion of one or more of the elements with the module fixture including one more apertures communicated with one or more of the bonding wells; (b) applying the UV curing modality selectively to a first portion of the dispensed adhesive in a seal zone, the seal zone including one or more regions surrounding the apertures, wherein the dispensed adhesive in the seal zone is sufficiently cured to inhibit significant quantities of the adhesive from emerging from the apertures while the adhesive continues to be dispensed into the module fixture; and after that, applying the UV curing modality to the second portion of the adhesive. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
