| 摘要 |
PROBLEM TO BE SOLVED: To prevent abrasive particles from falling from a polishing tape as much as possible during polishing; and to prevent the fallen abrasive particles from entering an element forming area or the like in a center of a substrate even if the abrasive particles are fallen from the polishing tape during polishing a surface peripheral part of the substrate. SOLUTION: A polishing apparatus includes: a polishing head 12 that polishes a surface of the substrate W by pressing a surface of the polishing tape 20 to a surface of the substrate W while running the polishing tape 20, which has the abrasive particles fixed on the surface thereof, in one direction; and a conditioning apparatus (cleaning apparatus) 30 that is arranged at an upstream side of the polishing head 12 along the running direction of the polishing tape 20 and that conditions the surface in advance for preventing the abrasive particles from falling during polishing the surface of the polishing tape 20. COPYRIGHT: (C)2011,JPO&INPIT |
