DEVICE AND METHOD OF MEASURING PHYSICAL PROPERTY, THIN-FILM SUBSTRATE MANUFACTURING SYSTEM, AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a physical property measuring device, a method of measuring physical properties, a thin-film substrate manufacturing system, and a program for nondestructively and precisely measuring physical properties of a thin film formed on the surface of a substrate.

SOLUTION: The physical property measuring device for measuring physical properties of a thin film H formed on a surface of a substrate K includes: a terahertz wave generation source for generating terahertz waves; a moving means of moving the substrate K and the thin film H so that terahertz waves from the terahertz wave generation source are applied to a non-formation region N where no thin films H are formed on surfaces of a film formation region F in which the thin film H is formed on a surface of the substrate K and on the surface of the substrate K; a detection means of detecting an electric field strength of transmission waves or reflection waves from the film formation region F and the non-formation region N for a plurality of times; and an integration means of integrating the electric field strength of transmission waves or reflection waves detected by the detection means for a plurality of times; and a measurement means of measuring a time change of the electric field strength of the transmission waves or reflection waves integrated by the integration means.

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