发明名称 |
METHOD OF FORMING SEMICONDUCTOR COMPOSITE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To form a patterned silicon-on-insulator (SOI)/silicon-on-nothing (SON) composite structure by a porous Si technique. SOLUTION: A patterned SOI/SON composite structure and a method of forming the same are provided. In the SOI/SON composite structure, a patterned SOI/SON structure is sandwiched between an Si overlayer and a semiconductor substrate. The method of forming the patterned SOI/SON composite structure includes a shared processing treatment step wherein both SOI and SON structures are formed. This invention further provides a method of forming a composite structure including an embedded conductive/SON structure, and a method of forming a composite structure including only an embedded void plane. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011181955(A) |
申请公布日期 |
2011.09.15 |
申请号 |
JP20110111716 |
申请日期 |
2011.05.18 |
申请人 |
INTERNATL BUSINESS MACH CORP |
发明人 |
BENDERNAGEL ROBERT E;CHO KWANG SU;BIJAN DAVARI;FOGEL KEITH E;SADANA DEVENDRA K;SHAHIDI GHAVAM G;TIWARY SANDIP |
分类号 |
H01L27/12;H01L21/02;H01L21/20 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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