发明名称 METHOD OF FORMING SEMICONDUCTOR COMPOSITE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To form a patterned silicon-on-insulator (SOI)/silicon-on-nothing (SON) composite structure by a porous Si technique. SOLUTION: A patterned SOI/SON composite structure and a method of forming the same are provided. In the SOI/SON composite structure, a patterned SOI/SON structure is sandwiched between an Si overlayer and a semiconductor substrate. The method of forming the patterned SOI/SON composite structure includes a shared processing treatment step wherein both SOI and SON structures are formed. This invention further provides a method of forming a composite structure including an embedded conductive/SON structure, and a method of forming a composite structure including only an embedded void plane. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181955(A) 申请公布日期 2011.09.15
申请号 JP20110111716 申请日期 2011.05.18
申请人 INTERNATL BUSINESS MACH CORP 发明人 BENDERNAGEL ROBERT E;CHO KWANG SU;BIJAN DAVARI;FOGEL KEITH E;SADANA DEVENDRA K;SHAHIDI GHAVAM G;TIWARY SANDIP
分类号 H01L27/12;H01L21/02;H01L21/20 主分类号 H01L27/12
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