| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for manufacturing a semiconductor wafer joining element stably and electrically connecting a laminated semiconductor wafer and a connection unit that the semiconductor wafer includes and having a simple process, and to provide a semiconductor device, a method of manufacturing an electronic component having high connection reliability, and an electronic component. SOLUTION: A conductive connection material including a laminated structure comprising a resin composition 61 and metal foil 62 selected from solder foil or tin foil is interposed between a semiconductor wafer 210 and a semiconductor wafer 220. Furthermore, the metal foil is fused by heating, and the metal foil is aggregated and solidified between connection electrodes 212, 222 of the semiconductor wafer. Additionally, the resin composition is cured or coagulated to stick the semiconductor wafers. COPYRIGHT: (C)2011,JPO&INPIT
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