| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that effectively prevents solder from permeating to get in between a wiring conductor forming a semiconductor element connection pad and a solder resist layer, and to provide a method of manufacturing the same. SOLUTION: The wiring board is constituted by sequentially bonding to an upper surface a plurality of semiconductor element connection pads 3 made of a wiring conductor 2 and the solder resist layer 4 which covers an outer periphery of a semiconductor element connection pad 3 and has an opening 4a exposing a center part of the semiconductor element connection pad 3, and also welding a solder bump 5 to the semiconductor element connection pad 3 exposed from the opening 4a, wherein the wiring conductor 2 includes a roughened surface of 2.5 to 4μm in 10-point average roughness Rz as a surface covered with the solder resist layer 4 and a recess surface gradually recessed to a depth of 1 to 4μm from a lower end of the opening 4a as a surface exposed from the opening 4a. COPYRIGHT: (C)2011,JPO&INPIT |
