发明名称 Memory Cells, Methods Of Forming Dielectric Materials, And Methods Of Forming Memory Cells
摘要 Some embodiments include memory cells. The memory cells may include a tunnel dielectric material, a charge-retaining region over the tunnel dielectric material, crystalline ultra-high k dielectric material over the charge-retaining region, and a control gate material over the crystalline ultra-high k dielectric material. Additionally, the memory cells may include an amorphous region between the charge-retaining region and the crystalline ultra-high k dielectric material, and/or may include an amorphous region between the crystalline ultra-high k dielectric material and the control gate material. Some embodiments include methods of forming memory cells which contain an amorphous region between a charge-retaining region and a crystalline ultra-high k dielectric material, and/or which contain an amorphous region between a crystalline ultra-high k dielectric material and a control gate material.
申请公布号 US2011220989(A1) 申请公布日期 2011.09.15
申请号 US201113116401 申请日期 2011.05.26
申请人 MICRON TECHNOLOGY, INC. 发明人 RAMASWAMY D. V. NIRMAL;ROCKLEIN NOEL;MIN KYU S.
分类号 H01L29/792;H01L21/28 主分类号 H01L29/792
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