LIGHT-EMITTING DIODE PACKAGE

摘要

Disclosed is a light-emitting diode package, comprising high-output and high-efficiency light-emitting diodes in which the efficiency droop phenomenon, which occurs in response to the injection of high current, is prevented to achieve improved light emission efficiency. The light-emitting diode package is configured such that the surface of a base on which the light-emitting diodes are to be attached is curved by means of a device or a specific structure, and the light-emitting diodes are die-bonded to the curved surface so as to enable the light-emitting diodes to be bent by the curvature of the curved surface. Here, stresses are applied to the light-emitting diodes, thus causing changes in a band structure of a quantum well layer. In the thus-produced light-emitting diode package, efficiency droop, which occurs in response to the injection of high current, is reduced to achieve the high output and high efficiency of the package.