| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid image pickup apparatus 1 which can be disposed inside a small space. <P>SOLUTION: The solid image pickup apparatus includes: a device chip 10 including a first principal surface 14 and a second principal surface 15, and a CMOS device 11 as a solid image pickup device and an electrode portion 12 being formed on the first principal surface 14; a holding block 20 including a joining surface 22 joined to the second principal surface 15 and an inclined surface 21 inclined inward at a predetermined angle relative to the joining surface 22; and a wiring board 30 including a distal end portion 30T including a connection portion 31 connected to the electrode portion 12 on the first principal surface 14, an extending portion 30C that is in contact with the inclined surface 21, the extending portion being joined to the inclined surface via a bonding layer 23, and a flexure portion 30V flexed at the predetermined angle between the distal end portion 30T and the extending portion 30C. <P>COPYRIGHT: (C)2011,JPO&INPIT |
