| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide flux for soldering which can suppress the generation of voids in a solder metal, and also can suppress the scattering of flux and the solder metal, and a solder paste composition using the same. <P>SOLUTION: The flux for soldering comprises acid-modified polyolefin. Further, the flux comprises a base resin and an activator, the base resin is made of rosin or a synthetic resin, and the flux further comprises acid-modified polyolefin. The paste composition comprises the above flux for soldering and the solder alloy powder. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
