发明名称 SUBSTRATE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a substrate structure such that electronic components are mounted on a first wiring board and a second wiring board without damaging the respective wiring boards. SOLUTION: When connector housings 11 and 12 are mounted on the first wiring board 10 and the second wiring board 20 which are arranged in parallel, a projection part 13 of the connector housing 11 is inserted into a hole part 10a of the first wiring board 10 from above. A projection part 23 of the connector housing 21 is inserted into a hole part 20a of the second wiring board 20 from below. The projection part 13 of the connector housing 11 which protrudes from the hole part 10a of the first wiring board 10, and the projection part 23 of the connector housing 21 which protrudes from the hole part 20a of the second wiring board 20 are brought into contact with each other, and fixed in one body. This substrate structure is employed to mount the connector housings 11 and 21 on the wiring boards 10 and 20 without damaging the wiring boards 10 and 20. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181831(A) 申请公布日期 2011.09.15
申请号 JP20100046844 申请日期 2010.03.03
申请人 FURUKAWA ELECTRIC CO LTD:THE;FURUKAWA AUTOMOTIVE SYSTEMS INC 发明人 NAKAZATO HIDEKI;SAITO SHINYA;ITO AKINORI;YAMAUCHI YUJI
分类号 H05K1/14 主分类号 H05K1/14
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