| 发明名称 |
LED-PACKAGING RESIN BODY, LED DEVICE, AND METHOD FOR MANUFACTURING LED DEVICE |
| 摘要 |
<p>Disclosed is an LED-packaging resin body which includes: a fluorescent material (13); a heat-resistant material (15) disposed on the surface of the fluorescent material (13) or in the vicinity of the surface; and a silicone resin (12) wherein the fluorescent material (13) having the heat-resistant material (15) disposed therein is dispersed.</p> |
| 申请公布号 |
WO2011111293(A1) |
申请公布日期 |
2011.09.15 |
| 申请号 |
WO2011JP00584 |
申请日期 |
2011.02.02 |
| 申请人 |
PANASONIC CORPORATION;OHBAYASHI, TAKASHI;SHIRAISHI, SEIGO |
发明人 |
OHBAYASHI, TAKASHI;SHIRAISHI, SEIGO |
| 分类号 |
H01L33/56 |
主分类号 |
H01L33/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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