| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which attains thinning of a device regardless of the size of a connection terminal and prevents deterioration of electric characteristics, and to provide a semiconductor device which uses the package. <P>SOLUTION: The package 11 for housing a semiconductor element includes a base plate 21 having a top surface a part of which is recessed downward to form a recessed portion 37; a peripheral wall 22 prepared on the top surface of the base plate; a lid 23 prepared above the peripheral wall to form a housing space for a semiconductor element along with the base plate and the peripheral wall; and a feed-through terminal 25 for external connection, having a lower end which is disposed below the top surface of the base plate, other than the recessed portion and fixed in the recessed portion. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
