发明名称 HEAT TREATMENT EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide heat treatment equipment capable of effectively utilizing heat retained by a floor section, a ceiling section, a side wall section and the like of a target area while simplifying an operation. <P>SOLUTION: This heat treatment equipment is provided with a device body performing heat treatment to the target area for cooling or heating, and a control means H controlling an operation of the device body, and further provided with a heat treatment-free time input means 14 for inputting a heat treatment-free time when the heat treatment to the target area becomes unnecessary, and the control means H is constituted to execute a pre-stop processing for controlling the device body from an operation state to a stop state at the time before the heat treatment-free time by a predetermined pre-stop time. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011179749(A) 申请公布日期 2011.09.15
申请号 JP20100044230 申请日期 2010.03.01
申请人 OSAKA GAS CO LTD 发明人 KUSAKA ATSUSHI
分类号 F24F11/02 主分类号 F24F11/02
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