METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a technology suitable for dividing a semiconductor wafer into a plurality of semiconductor chips at appropriate positions.

SOLUTION: A semiconductor wafer 11 is divided by using the modified regions 3, the semiconductor wafer 11 having one-side principal surface and the other-side principal surface on the side opposite thereto, wherein modified regions 3 formed by multiphoton absorption and extending in a predetermined direction parallel to the one-side principal surface exist in the inside, and cracks reaching the one-side principal surface from the modified regions 3 are formed in parallel to the predetermined direction.

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