METHOD FOR PRODUCING A COMPONENT THAT IS EMBEDDED IN AN INSULATING MATERIAL AND COMPRISES BUMPS AND CONDUCTOR TRACKS THAT OVERLAP SAID BUMPS AND CORRESPONDING DEVICE

摘要

The invention relates to a method for producing an electronic unit (1), wherein at least one electronic component (2) is at least partially embedded in an insulating material (4), comprising the following steps: providing a film assembly (7' + 10) with at least one conductive layer (7') and a carrier layer (10), or with only a conductive layer (7), structuring the conductive layer (7, 7') so as to produce openings in the form of blind holes or through holes (8) for receiving bumps (3) that are connected to the contact surfaces of the at least one electronic component (2), applying an adhesive layer (5) to the conductive layer (7, 7') provided with openings (8), placing the at least one component (2) on the film assembly (7' + 10), or in the conductive layer (7), such that the bumps (3) engage with the openings (8) of the conductive layer, partially embedding the at least one component (2) from the side opposite the bumps (3) into a dielectric layer (4), removing the carrier layer (10) of the film assembly (10 + 7'), or a part of the conductive layer (7), such that the surface of the bumps (3) is exposed, depositing a metallization layer on the side of the remaining conductive layer (7') having the exposed bumps (3), and structuring the metallization layer and the conductive layer (7) so as to produce conductor tracks (6) that overlap the bumps. The invention further relates to an electronic unit (1) produced by such a method.