发明名称 GRAPHENE BASED THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE
摘要 A three-dimensional (3D) integrated circuit (IC) structure includes a first layer of graphene formed over a substrate; a first level of one or more active devices formed using the first layer of graphene; an insulating layer formed over the first level of one or more active devices; a second layer of graphene formed over the insulating layer; and a second level of one or more active devices formed using the second layer of graphene, the second level of one or more active devices electrically interconnected with the first level of one or more active devices.
申请公布号 CA2787094(A1) 申请公布日期 2011.09.15
申请号 CA20112787094 申请日期 2011.02.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GUO, DECHAO;HEN, SHU-JEN;LIN, CHUNG-HSUN;SU, NING
分类号 H01L21/77;H01L29/06;H01L29/16 主分类号 H01L21/77
代理机构 代理人
主权项
地址