| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide metal interconnect connection of high reliability. <P>SOLUTION: A plurality of vias (24) are formed through a polyimide flex layer (22) and an adhesive layer (23) correspondingly to respective die pads (14). A plurality of metal interconnects (28) are formed on the polyimide flex layer (22), and each metal interconnect (28) has a cover pad (31) covering a portion of a top surface (30) of the polyimide flex layer (22), a sidewall (36) extending down from the cover pad (31) and through the via (24) along a perimeter thereof, and a base (34) connected to the sidewall (36) and forming an electrical connection with a respective die pad (14). Each of the base (34) and the sidewall (36) is formed so as to have a thickness that is equal to or greater than a thickness of the adhesive layer (23). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
