| 摘要 |
Electrical finite element analysis is carried out on a circuit design, which includes devices, to determine an acceptable power-performance envelope and to obtain data for circuit temperature mapping. A circuit temperature map is developed for the circuit design, based on the data for circuit temperature mapping. Thermo-mechanical finite element analysis is carried out on a package design for the circuit design, based on the circuit temperature map, to determine a package reliability limit based on thermal stress considerations. It is determined whether the package design and the circuit design jointly satisfy: (i) power-performance conditions specified in the acceptable power-performance envelope; and (ii) the package reliability limit based on the thermal stress considerations.
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