发明名称 |
FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE |
摘要 |
A fabrication method for a resin encapsulated semiconductor device includes the steps of: (1) die-bonding a semiconductor device to a first electrical connection metallic terminal of a wiring substrate; (2) electrically connecting an electrode of the semiconductor device and a second electrical connection metallic terminal of the wiring substrate via an electrical connector; (3) surface treating such an assembly by applying a solution to a surface of the assembly and baking the applied solution; and (4) transfer-molding an insulating encapsulating resin onto the surface-treated assembly. |
申请公布号 |
US2011223720(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US201113108430 |
申请日期 |
2011.05.16 |
申请人 |
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发明人 |
KAJIWARA RYOICHI;MOTOWAKI SHIGEHISA;ITOU KAZUTOSHI;HOZOJI HIROSHI |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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