MULTILAYER WIRING SUBSTRATE STRUCTURE EQUIPPED WITH POWER SOURCE AND GROUND PAIR LINES

摘要

A multilayer wiring substrate which comprises a laminate (10) composed of an insulator layer and a patterned conductor layer, and which additionally comprises a first conductive line (1) for a power source and a second conductive line (2) for grounding which are arranged in parallel with each other in the laminate(10) and a first laminate film which is so arranged as to spread over the upper surface of the first conductive line (1) and the upper surface of the second conductive line (2) and is composed of a first insulating film (3) and a first conductive film (4) (a conductive or semiconductive film) laminated sequentially from the first and second conductive lines side.