| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate dividing method which can easily achieve a good adhesion state between an aggregate substrate and a dicing tape when cutting the aggregate substrate. SOLUTION: The substrate dividing method includes (i) a first step for pasting a dicing tape 20 on one principal plane of an aggregate substrate 10 containing a portion which is formed into a plurality of individual substrates 16, and (ii) a second step for cutting the aggregate substrate 10 from the opposite side of the dicing tape 20 on the aggregate substrate 10 with a dicing blade 26, to divide the individual substrate 16 from the aggregate substrate 10. After the first step and before the second step, the substrate dividing method includes (a) a resin applying step for applying a not-yet-cured resin 22 on the outer peripheral edge part of the aggregate substrate 10 of the aggregate substrate 10 and dicing tape 20, and (b) a resin curing step for curing the applied resin 22. The second step is performed in a state that the cured resin 22 is adhered to the aggregate substrate 10 and the dicing tape 20. COPYRIGHT: (C)2011,JPO&INPIT |
