| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To inspect any bend (warp), distortion, twist (swell) or the like of a substrate at a place where the laser beam machining is actually performed. <P>SOLUTION: The state of any bend (warp), distortion, twist (swell) or the like of a substrate 1 is detected by measuring the surface displacement of the substrate while moving the substrate at an actual place where the laser beam machining is performed before performing the laser beam machining of the substrate 1. Thus, it is determined whether the state of the substrate is within a permissible range or largely deviated therefrom. When the state is large deviated therefrom, the state is displayed, an alarm is generated, or the substrate can be removed from the line as a non-correctable substrate. Thus, the quality of the substrate can be controlled. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
