| 摘要 |
The present invention is a sealing laminated sheet for an electronic device in which a first sheet and a second sheet 5 are laminated, wherein the first sheet contains an acid-modified polyolefin-based thermoplastic resin, the second sheet 5 has a melting point higher than that of the first sheet, and a peel strength at 25° C. of the second sheet 5 relative to the first sheet is 0.5 to 10.0 N/15 mm. According to the present invention, the production yield of an electronic device can be improved.
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