发明名称 FILM SURFACE TREATMENT DEVICE
摘要 <p>Disclosed is a film surface treatment device which prevents contamination of electrodes and the like when plasma treating a film to be treated such as a protective polarising film using a polymerisable monomer as a reactive component, and improves the effects of treatment on adhesive properties and the like. A film to be treated (9) is wound onto a first roller electrode (11) and a second roller electrode (12). The electrodes (11, 12) are rotated and the film to be treated (9) is conveyed from electrode (11) to electrode (12). Nozzles for reactant gas (31) are disposed along the circumferential direction of the first roller electrode (11), distanced from the upstream side of a discharge space (14) between the electrodes (11, 12) in the direction of rotation thereof, facing the first roller electrode (11). The first roller electrode (11) is preferably covered by a shield (40). A reactant gas containing a polymerisable monomer is sprayed from the nozzles (31). A discharge product gas nozzle (21) is disposed inside the turning area (9a) for the film to be treated (9), located between the first and second roller electrodes (11, 12). A discharge product gas which does not contain a polymerisable monomer is sprayed from the discharge product gas nozzle (21) towards the discharge space (14).</p>
申请公布号 WO2011111558(A1) 申请公布日期 2011.09.15
申请号 WO2011JP54497 申请日期 2011.02.28
申请人 SEKISUI CHEMICAL CO., LTD.;NAKANO YOSHINORI;NOGAMI MITSUHIDE;KAWASAKI SHINICHI;SATOH TAKASHI;MATSUZAKI JUNICHI 发明人 NAKANO YOSHINORI;NOGAMI MITSUHIDE;KAWASAKI SHINICHI;SATOH TAKASHI;MATSUZAKI JUNICHI
分类号 C08J7/00;G02B1/12;G02B5/30;H05H1/24 主分类号 C08J7/00
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