发明名称 THERMOSETTING RESIN COMPOSITIONS AND ARTICLES
摘要 The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.
申请公布号 WO2011025961(A4) 申请公布日期 2011.09.15
申请号 WO2010US46998 申请日期 2010.08.27
申请人 PARK ELECTROCHEMICAL CORPORATION;QIANG, WEI;WANG, KE;LEYS, DOUG;ALMEN, GREG 发明人 QIANG, WEI;WANG, KE;LEYS, DOUG;ALMEN, GREG
分类号 C08K5/527;B32B5/28;C08K9/00 主分类号 C08K5/527
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