发明名称 |
THERMOSETTING RESIN COMPOSITIONS AND ARTICLES |
摘要 |
The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz. |
申请公布号 |
WO2011025961(A4) |
申请公布日期 |
2011.09.15 |
申请号 |
WO2010US46998 |
申请日期 |
2010.08.27 |
申请人 |
PARK ELECTROCHEMICAL CORPORATION;QIANG, WEI;WANG, KE;LEYS, DOUG;ALMEN, GREG |
发明人 |
QIANG, WEI;WANG, KE;LEYS, DOUG;ALMEN, GREG |
分类号 |
C08K5/527;B32B5/28;C08K9/00 |
主分类号 |
C08K5/527 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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