| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-tank electrolytic copper plating method for quickening the speed of electrolytically plating an electrolytic plating layer on the surface of a conductive composition layer which includes silver particles and resin binder and is formed in a pattern shape on a substrate sheet, and to provide a method for manufacturing an electromagnetic wave shielding material with satisfactory productivity by using the multi-tank electrolytic copper plating method. SOLUTION: The multi-tank electrolytic copper plating method, when causing a continuous belt-like sheet material So to pass through the multi-tank electrolytic copper plating apparatus 20 provided with a plurality of electrolytic copper plating tanks to perform electrolytic copper plating, includes a process of causing the continuous belt-like sheet material So to pass through at least one electrolytic copper plating tank 21x to which power is not supplied in spite of such a state that the sheet material can be plated if power is supplied to the electrolytic copper plating tank 21x and, thereafter, causing the sheet material So to pass through at least one electrolytic copper plating tank 21o to which power is supplied to perform the electrolytic copper plating. By causing the continuous belt-like sheet material So to pass through at least one electrolytic copper plating tank 21x to which power is not supplied before the electrolytic copper plating, the surface resistance is reduced and the subsequent electrolytic copper speed is quickened. According to the multi-tank electrolytic copper plating method, the sheet material formed by printing a conductive composition layer on a transparent base as a base sheet is used to manufacture the electromagnetic wave shielding material. COPYRIGHT: (C)2011,JPO&INPIT
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