| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition device and a film deposition chamber reducing an amount of powder drifting in a film deposition chamber, adhering to a wall of the film deposition chamber and remaining in the film deposition chamber, and suppressing leakage of the powder to an external part of the film deposition chamber, in the film deposition device in which fine powder may be generated in a film deposition step. SOLUTION: A providing position of an exhaust port, to which a vacuum pump for evacuating the film deposition chamber is attached, is set considering a main flow of the powder in the film deposition chamber for reducing the powder remaining in the film deposition chamber and a sucking amount of the powder in an exhaust system is increased. COPYRIGHT: (C)2011,JPO&INPIT
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