WIRING SUBSTRATE, ELECTRONIC DEVICE, AND NOISE SHIELDING METHOD

摘要

A wiring substrate (100) is provided with: power supply planes (141, 143) which are arranged in a D layer (140) on either side of a gap (147); connection members (182, 183, 184) which electrically connect at least one of the power supply planes (141, 143) and an electronic element (181); a plurality of conductor elements (121) which, by being arranged in a repeating fashion, surround a first region, which includes the connection members (182, 183, 184) and at least part of the gap (147); and ground planes (111, 171) which are arranged in an A layer (110) or a G layer (170), and which extend into a third region or a second region containing a region which faces the first region, and a region which faces the conductor elements (121).