<p>Disclosed is an electronic apparatus wherein an electronic component is prevented from peeling from a circuit board. The electronic apparatus (10) is provided with: the circuit board (25); an electronic component (28), which is mounted on the circuit board (25) with a solder ball (26) therebetween; a cover member (30), which is mounted on the circuit board (25) such that the cover member surrounds and covers the electronic component (28); and a protruding section (34) provided on the top panel section (32) of the cover member (30). The protruding section (34) is deformable from a first state wherein the protruding section protrudes to the side opposite to the circuit board (25) to a second state wherein the protruding section protrudes to the circuit board (25) side. The deformed protruding section (34) can be brought into contact with the top portion (28a) of the electronic component (28) by having the protruding section (34) deformed into the second state.</p>
