发明名称 Selegiline-containing adhesive preparation
摘要 <p>The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (-)-(R)-N,±-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and one or two or more stabilizers selected from the group consisting of 2-mercaptobenzimidazole, sodium sulfite, butylhydroxyanisole and butylhydroxytoluene.</p>
申请公布号 EP2364733(A2) 申请公布日期 2011.09.14
申请号 EP20110157780 申请日期 2011.03.11
申请人 NITTO DENKO CORPORATION;FUJIMOTO CO., LTD. 发明人 INOSAKA, KEIGO;AMEYAMA, SATOSHI;NAKAMURA, KOJI;SEKIYA, JUNICHI
分类号 A61K9/70;A61K31/137;A61K47/02;A61K47/10;A61K47/22 主分类号 A61K9/70
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