Light-emitting device

摘要

A light-emitting device has a submount and a plate for heat transfer having a metallic plate (30). The submount has a mount base (10), at least one light-emitting diode chip (50) mounted thereon and electrically conducting (12,15) lines formed on the mount base to be connected electrically to the light-emitting diode chip. A first plane of the mount base of the submount is bonded thermally to the first plate. For example, the plate is a circuit board having a metallic plate, and the submount is bonded thermally to the metallic plate of the one of the at least one plate. In an example, a plurality of grooves (7) are formed at the bottom of the mount base (10).