发明名称 |
LAMINATE FOR ELECTRONIC MATERIAL |
摘要 |
<p>This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol% or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bisÄ4-(4-aminophenoxy)phenylÜpropane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.</p> |
申请公布号 |
EP1393894(B1) |
申请公布日期 |
2011.09.14 |
申请号 |
EP20020724621 |
申请日期 |
2002.04.19 |
申请人 |
NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
OHTA, TAKUHEI;HIRAISHI, KATSUFUMI;TAKARABE, TAEKO;TAKIYAMA, SYUJI;KABEMURA, ERI;MIYAMOTO, KAZUYA;MATSUDA, TAKASHI;SAWAMURA, TAZO |
分类号 |
B32B15/08;B32B27/00;B32B27/34;C08G73/10;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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