发明名称 |
Device with through-hole interconnection and method for manufacturing the same |
摘要 |
A device having improved electrical connection includes a first substrate (11) including a first side and a second side; a functional element (12) on the first side of the first substrate; a pad (13) that is electrically connected to the functional element; and a through-hole interconnection (15) provided in a hole extending through the first substrate from the first side to the second side, the through-hole interconnection including a first conductive material (17) and being electrically connected to the pad, and a conductive region (18) that is provided along a portion of an inner surface of the hole, and is made of a second conductive material, different from the first conductive material. |
申请公布号 |
EP1577942(A3) |
申请公布日期 |
2011.09.14 |
申请号 |
EP20050290559 |
申请日期 |
2005.03.14 |
申请人 |
FUJIKURA LTD. |
发明人 |
YAMAMOTO, SATOSHI;SUEMASU, TATSUO |
分类号 |
H01L21/768;H01L27/14;H01L21/3205;H01L23/52;H01L27/146;H01L31/02;H01L33/48;H01S5/022;H05K1/03;H05K1/11;H05K3/38;H05K3/40 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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